产品展厅
产品展厅
汉高热熔胶Macromelt 6208/6208S低压注塑封装材料是基于自然脂肪酸、二聚酯的热塑性热熔胶粘剂。它对BAS PBTPVC之类的塑料有良好的粘接性,并具有低温韧性,宽范围的工作温度以及超越的成型特性!
汉高热熔胶6208/6208S主要运用于电子元器件的封装,连接器防水密封,现场注塑制作索环,以及广泛应用于汽车电子产品:比如有轮胎压力监测系统(TPMS),座位乘员传感器用PCBs,安全锁传感器,机动车用ECU,空气质量传感器,RF装置用天线,智能钥匙(e-key)系统等等.
包装规格:20kg/袋
PS：汉高品牌升级，Macromelt更改为Technomelt,所以Macromelt6208/6208S也称之为Technomelt6208/6208S.（仅是更改产品名称,对产品质量无任何影响,所有技术认证依然有效!）
低压注塑成型工艺是以一种很低的注塑压力将热熔胶材料注入模具并快速固化成型（1-50秒）的封装工艺，以热熔胶材料 的密封性和优秀的物理，化学性能达到绝缘，耐温，抗冲击，减震，防潮，防水，防尘，耐化学腐蚀等功效。对电子元器件起到良好对保护作用。
与传统对灌封工艺（如双组份环氧／聚氨酯灌封）相比，低压注塑工艺不仅环保，同时大幅度提高生产效率可以帮助降低生产总成本。
标签：
汉高TECHNOMELT PA 6208(Amber）琥珀色颗粒 聚酰胺PA热熔胶
汉高TECHNOMELT PA 6208(BLACK）黑色颗粒 聚酰胺PA热熔胶
模塑热塑性聚酰胺热熔胶，设计用于模塑应用。
TECHNOMELT? PA 6208 (e)是一种琥珀色、模塑热塑性聚酰胺热熔胶，设计用于模塑应用。该材料可很好地粘合各种基材，包括金属和ABS。
设计用于模塑应用
可很好地粘合各种基材
PRODUCT DESCRIPTION
TECHNOMELT PA 6208 (e) provides the following product
characteristics:
Technology :Polyamide
Appearance : Amber
Components : One-component
Application :Molding compound thermoplastic
Cure :Physical setting
Typical Applications : Encapsulation
Flammability Rating : UL 94 V0
Operating TemperatureRange : -40 to 100oC (Depends on application, without mechanical stress)
TECHNOMELT PA 6208 (e) thermoplastic, hot melt adhesive is designed for molding compound applications.
This material adheres well to a variety of substrates including metals and ABS.
Softening Point, ℃ : 155℃
Melting Viscosity @ 210oC, mPa·s (cP) : 3,400
Temperature creep resistance, ℃ : 130℃
Elongation, % : 500
Hardness , Shore A : 82
Low Temperature Flexibility, ℃: -40
Application:
Application Temperature: 180 to 230℃
Application System: Hot Melt Application System
When bonding to a substrate with high thermal conductivity the use of
a specific application temperature is required for good wetting. Do not
heat the product above the specified application temperature range.
When the product is not in use do not apply heat, this will degrade the
quality of the product and in extreme cases cause carbonization.
TECHNOMELT PA 6208 (e) may absorb moisture from the air. This
will not be apparent in the solid form, but may cause bubbles on
heating and could affect the bond quality. It is important, therefore, that
containers are kept closed and sealed when not in use.
Cleaning:
Carbonized and set (non thermoplastic) material must be removed
mechanically. Removal of the thermoplastic material from the hot
apparatus can be achieved with solvent free cleaning system, such as
Technomelt 0062 (see separate technical information).
Storage:
Store in a cool, dry location, with the container tightly closed. When
not in used, this product will have a shelf life of at least 24 months.
用于电子成型的封装材料是基于自然脂肪酸、二聚酸的热塑性热熔胶粘剂。天然无毒无公害，可生物分解，可回收利用。
所有Technomelt与Thermelt材料都具备共同的优点，包括防水性封装、与多种基底 的粘接性、对多种环境刺激 的抵抗性、低粘度、高绝缘强度以及低温条件下更高的灵活性。这些天然原材料保持了宽广的工作温度范围(-50℃/ 170℃)，符合UL标准及RoHS/REACH环保规范。
