标签：

汉高TECHNOMELT PA 6208(Amber）琥珀色颗粒 聚酰胺PA热熔胶

汉高TECHNOMELT PA 6208(BLACK）黑色颗粒 聚酰胺PA热熔胶

功能与优点

模塑热塑性聚酰胺热熔胶，设计用于模塑应用。

TECHNOMELT? PA 6208 (e)是一种琥珀色、模塑热塑性聚酰胺热熔胶，设计用于模塑应用。该材料可很好地粘合各种基材，包括金属和ABS。

• 设计用于模塑应用

• 可很好地粘合各种基材

PRODUCT DESCRIPTION

TECHNOMELT PA 6208 (e) provides the following product

characteristics:

Technology :Polyamide

Appearance : Amber

Components : One-component

Application :Molding compound thermoplastic

Cure :Physical setting

Typical Applications : Encapsulation

Flammability Rating : UL 94 V0

Operating TemperatureRange : -40 to 100oC (Depends on application, without mechanical stress)

TECHNOMELT PA 6208 (e) thermoplastic, hot melt adhesive is designed for molding compound applications.

This material adheres well to a variety of substrates including metals and ABS.

Softening Point, ℃ : 155℃

Melting Viscosity @ 210oC, mPa·s (cP) : 3,400

Temperature creep resistance, ℃ : 130℃

Elongation, % : 500

Hardness , Shore A : 82

Low Temperature Flexibility, ℃: -40

Application:

Application Temperature: 180 to 230℃

Application System: Hot Melt Application System

When bonding to a substrate with high thermal conductivity the use of

a specific application temperature is required for good wetting. Do not

heat the product above the specified application temperature range.

When the product is not in use do not apply heat, this will degrade the

quality of the product and in extreme cases cause carbonization.

TECHNOMELT PA 6208 (e) may absorb moisture from the air. This

will not be apparent in the solid form, but may cause bubbles on

heating and could affect the bond quality. It is important, therefore, that

containers are kept closed and sealed when not in use.

Cleaning:

Carbonized and set (non thermoplastic) material must be removed

mechanically. Removal of the thermoplastic material from the hot

apparatus can be achieved with solvent free cleaning system, such as

Technomelt 0062 (see separate technical information).

Storage:

Store in a cool, dry location, with the container tightly closed. When

not in used, this product will have a shelf life of at least 24 months.

用于电子成型的封装材料是基于自然脂肪酸、二聚酸的热塑性热熔胶粘剂。天然无毒无公害，可生物分解，可回收利用。

所有Technomelt与Thermelt材料都具备共同的优点，包括防水性封装、与多种基底 的粘接性、对多种环境刺激 的抵抗性、低粘度、高绝缘强度以及低温条件下更高的灵活性。这些天然原材料保持了宽广的工作温度范围(-50℃/ 170℃)，符合UL标准及RoHS/REACH环保规范。